Thermoelectric Cooler Controller and Angled Mounting Thereof

ABSTRACT

A thermal management system for an enclosure containing electrical components includes a thermoelectric cooling unit for controlling temperature inside the enclosure and a controller for the cooling unit, the controller being configured so that it can be installed within and protected by the enclosure, rather than requiring its own separate secure enclosure. The controller can further be installed within a housing of the thermoelectric cooling unit, which housing does not increase the footprint of the cooling unit. The housing can include a cover that separates the space within the housing into two compartments, with the controller mounted at an angle that allows the controller to fit within one of the compartments and under the cover.

RELATED APPLICATIONS

This application is a continuation-in-part of co-pending U.S. patentapplication Ser. No. 15/284,252, entitled “SMALL FOOTPRINTTHERMOELECTRIC COOLER CONTROLLER,” and filed Oct. 3, 2016, whichapplication is a non-provisional of U.S. Prov. App. Ser. No. 62/235,987,filed Oct. 1, 2015, and having the same title, and which application isa continuation-in-part of U.S. patent application Ser. No. 14/555,173,entitled “THERMOELECTRIC COOLER CONTROLLER,” and filed Nov. 26, 2014,now U.S. Pat. No. 9,516,783, all of which previous patent applicationsare incorporated fully herein by reference.

BACKGROUND

Thermal management systems are often used to provide cooling toelectronic and electrical components, such as in manufacturing controls,telecom equipment, data networks, and/or other vital systems to optimizeoperating conditions of the electronic and electrical components. Atypical thermal management system for cooling a main enclosure mayinclude one or more cooling units, a controller, and a controllerenclosure.

The main enclosure contains the electrical and electronic componentsthat are to be cooled, and may be fireproof, which requires precise,low-tolerance design to protect the components. The cooling unit(s) aremounted within the main enclosure and may include a fan and a heat sinkfor removing heat from the main enclosure. The controller generallyprovides commands to the cooling units through an electrical signal,while power for the cooling units is provided from a separate powersource. In some applications the controller may be used to power andcontrol the cooling modules. In this situation, the wires bringing powerinto the controller and the wires taking power out of the controller andinto the cooling units are typically hard wired to the controller, andthe cooling modules are electrically connected to a terminal block ofthe controller. This complicates installation of the controller,swapping of a first controller for a second controller, and relocationof the thermal management system.

Most controllers do not meet the space constraints within the mainenclosure and are mounted outside of the main enclosure. In order toprovide the necessary hardwire connection and, in fireproof or otherwisesecure applications, to enclose and protect the controller, a controllerenclosure, as shown in FIG. 1, is needed. The controller enclosure maybe attached to an outside surface of the main enclosure or may beattached to a surface external to the main enclosure, such as a nearbywall. This results in more material being used to build a secondenclosure, more space being used up overall by the thermal managementsystem, and more complexity in installation the thermal managementsystem.

Accordingly, it would be useful to provide a controller that takes upless space, that does not require its own separate enclosure, and thatprovides for a simpler connection between an input on the controller andan output on the controller to simplify installation and modification ofthe thermal management system.

SUMMARY

In one embodiment, the present disclosure provides a thermal managementsystem for an enclosure containing electrical components. The thermalmanagement system includes a thermoelectric cooling unit mounted on theenclosure such that the cooling unit cools an interior space of theenclosure. The cooling unit has a fan for driving air into the interiorspace. The thermal management system further includes a controllerlocated within the housing in electrical communication with the coolingunit and configured to operate one or more components of the coolingunit. The controller includes a circuit board, an input quick connectordisposed on the circuit board and configured to receive a first cableconnector for providing power to the circuit board, and an output quickconnector disposed on the circuit board in electrical communication withthe input quick connector and configured to receive a second cableconnector for supplying power from the input quick connector to thethermoelectric cooling unit. The controller further includes one or moredevice headers for connecting a thermal management component, such asone or more fans. The controller can be mounted inside the enclosure,and can be mounted under a cover within the enclosure.

The controller and the cooling unit can both be mounted to an interiorsurface of the enclosure. The input quick connector can be a five pinconnector, and can provide to the circuit board a positive voltage, anegative voltage, a common ground, a normal open, and a normal close.The output quick connector can be a two pin connector, and can supplyfrom the controller a negative H-bridge signal and a positive H-bridgesignal. The circuit board can include a thermistor connector.

In another embodiment, the present disclosure provides a controller fora thermal management unit. The controller includes a circuit boardmountable to the thermal management unit or within a main enclosuremanaged by the thermal management unit such that the controller isenclosed within the main enclosure. The controller further includes afirst quick disconnect connector disposed on the circuit board andconfigured to receive a first cable connector for providing power to thecircuit board, and a second quick disconnect connector disposed on thecircuit board and configured to receive a second cable connector forsupplying power to a device controlled by the controller. The firstquick disconnect connector can be a five pin connector, and can provideto the controller a positive voltage, a negative voltage, a commonground, a normal open, and a normal close. The second quick disconnectconnector can be a two pin connector, and can provide from thecontroller a positive H-bridge signal and a negative H-bridge signal.The controller can further include one or more device headers eachconfigured to receive a device connector cable of a device controlled bythe controller. A device header can include pins for voltage out,control signal out, ground, and signal return.

The device controlled by the controller can be a fan of the thermalmanagement unit. The control signal out of the device header can controlthe speed of the fan. The signal return of the device header can receivea signal from the fan indicating the fan speed. The controller canmonitor the fan speed and generate an alert to a user if the fan speedis outside a predetermined operating range.

DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a prior art controller for athermoelectric cooling unit.

FIG. 2 is a perspective view of the controller of FIG. 1 in a controllerenclosure from the prior art, the controller enclosure shown open.

FIG. 3 is a perspective view of the controller enclosure of FIG. 2 shownclosed.

FIG. 4 is a top perspective view of a controller in accordance with thepresent disclosure.

FIG. 5 is schematic view of a thermal management system using thecontroller of FIG. 4.

FIG. 6 is a perspective view of the controller of FIG. 4 being mountedto a thermoelectric cooling unit within a main enclosure.

FIG. 7 is a top perspective view of another controller in accordancewith the present disclosure.

FIG. 8 is schematic view of the controller of FIG. 7.

FIGS. 9-17 are circuit diagrams of components of the controller of FIG.7.

FIGS. 18A-B are a bottom front perspective view of a thermal managementsystem in accordance with the present disclosure, where a removablecover of the housing is detached in FIG. 18A and attached in FIG. 18B.

FIG. 19 is a bottom view of the thermal management system of FIG. 18B.

FIG. 20 is a top view of the thermal management system of FIG. 18B.

FIG. 21 is a rear view of the thermal management system of FIG. 18B.

FIG. 22 is a front view of the thermal management system of FIG. 18B.

FIG. 23 is a left view of the thermal management system of FIG. 18B.

FIG. 24 is a right view of the thermal management system of FIG. 18B.

FIG. 25 is a bottom front perspective view of a thermal managementsystem in accordance with the present disclosure, where a removablecover of the housing is detached.

DETAILED DESCRIPTION

The present inventive controller overcomes the drawbacks of priorcontrollers through improvement of control circuits and application ofcircuit and electrical components that have not be previously applied inthe described manner. As a result of the improvements, the inventivecontroller can have a significantly reduced form factor and simplifiedpower connection and management, allowing the present controller to bemounted within the main enclosure. An example TEC that benefits from thepresent invention is the line of TE coolers by Pentair EquipmentProtection, sold under the HOFFMAN brand name (e.g., TE09, TE12, TE16products). Many other products satisfying industry standards forthermoelectric units, particularly compact, low-profile, Peltier effectheating or cooling thermoelectric units for small enclosures(collectively “TECs” herein), in particular those TECs rated at about200 W power consumption. The TECs and controllers are described hereinprimarily as “cooling” units, but it will be understood that, unlessotherwise indicated, the TECs and controllers can be configured toprovide temperature control in the form of cooled or heated airdelivered to the interior of the main enclosure.

For comparison purposes, FIGS. 1-3 illustrate an exemplary priorthermoelectric cooler (TEC) control module 10, which includes the TECcontroller 11 installed within its own housing 12. The TEC controller 11is designed to be hardwired to the terminal blocks 13 of the housing 12,thus requiring a plurality of wiring harness connectors 14 on the board15 of the TEC controller 11. Correspondingly, the board 15 must havesufficient area to accommodate the connectors 14. The illustrated board15 has dimensions of 3.85 in×5.25 in, which is typical of prior TECcontrollers. Furthermore, each connector 14 is connected to a terminalof the terminal blocks 13 via a separate wiring harness 16, addingcomplexity, parts, and assembly time to the module 10.

Another TEC controller that addresses the drawbacks described above isdescribed in U.S. patent application Ser. No. 14/555,173, entitled“THERMOELECTRIC COOLER CONTROLLER,” filed Nov. 26, 2014, which iscommonly owned by the present Applicant and is incorporated fully hereinby reference. This previously described controller is referred to hereinas the “STEC,” and for comparison purposes is illustrated in FIGS. 4-6.Referring to FIG. 4, an exemplary STEC 30 includes a circuit board 38, amicrocontroller 40, four electrolytic capacitors 42, a four position dipswitch 44, a MOSFET H-bridge 46, a female input quick connector 48, afemale output quick connector 50, and a thermistor connector 54. TheSTEC 30 achieves a circuit board 38 size that is small enough to fitinside the main enclosure typically managed by a TEC without interferingwith air flow within the enclosure. In particular, the circuit board 38may measure approximately 2.875 inches wide and 6.320 inches long. Theinput and output quick connectors 48, 50, and optionally the thermistorconnector 54, may be the only electrical cable connectors on the circuitboard 38, thus efficiently providing a one-in, one-out quick-connectpower connection for both the STEC 30 and a TEC fan or other componentpowered from the STEC 30. The four-position dip switch 44 has thecapacity to dedicate two switches to heating setpoints and two switchesto cooling setpoints. Each setpoint may be used to set a targettemperature for the TEC to reach, or alternatively two setpoints may beselected to act as an upper and lower desired temperature.

Referring to FIG. 5, the four-pin output connector 50 supplies acurrent, via circuit paths of the STEC 30, from the female input quickconnector 48 to an attached four-circuit output harness 56, which is inturn connected to a component of the TEC. The female output quickconnector 50 may, for example, connect to a fan 24 of the TEC (e.g., viaa terminal block 104 of the TEC). The four pins of the output connector50 may provide positive and negative fan voltage outputs for relayingpower from the power supply (not shown) to the fan 24, and also providean output for controlling the heating function of the TEC, and an outputfor controlling the cooling function of the TEC. A thermistor 58 canattach to the thermistor connector 54 and can be suitably positioned todetect a temperature to be monitored by the STEC 30, such as atemperature in or near the TEC or near a fan.

Referring to FIG. 6, due to its size the STEC 30 may be mounted directlyto the TEC 23, which itself is mounted (e.g., using a mounting plate 28attached to the TEC 23 by fasteners 32; the STEC 30 may then be mountedto the mounting plate 28 using a system of spacers 34 and fasteners 36)to the interior surface of a wall panel 22 of the main enclosure. TheSTEC 30 may alternatively be mounted elsewhere within the mainenclosure, limited by space constraints therein. Protected by the mainenclosure, the STEC 30 is an “open-frame” controller—it does not haveits own enclosure and its components are thus exposed to anyone oranything that accesses the interior of the main enclosure.

The present disclosure additionally provides a TEC controller thatadopts some of the improvements embodied in the STEC, and refines thecontroller layout, design, and firmware to further reduce the dimensionsof the printed circuit board while adding functionality related to TECmonitoring, alarming, and networking and communication. The presentdisclosure further provides implementations of a closed-frame TECcontroller and an integrated TEC that includes a controller enclosurefor protecting the TEC controller when it is located within the mainenclosure.

Referring to FIGS. 7 and 8, an implementation of the present controller70 can include a circuit board 72, a microcontroller 74, a plurality ofelectrolytic capacitors 76, such as four electrolytic capacitors 76, afive-position dip switch 78, a MOSFET H-bridge 80, a female input quickconnector 60, a female output quick connector 82, one or more multi-pindevice connection headers 90, 92, and a thermistor connector 100. Thecontroller 70 achieves a circuit board 72 size that is small enough tofit inside the main enclosure typically managed by a TEC withoutinterfering with air flow within the enclosure. Further, the controller70 is small enough to be mounted under a cover or within an enclosureinside the main enclosure as described below. In particular, the circuitboard 72 can measure approximately 3.850 inches wide and 5.075 incheslong. See FIG. 9 for exemplary circuit diagrams of a microcontroller 74pinout, serial, I2C, and programming ports of the controller 70, atemperature sensing circuit for processing input to the thermistorconnector 100, and visual indicator (e.g., LED) activation circuits.

The five-position dip switch 78 can have two switches dedicated toheating setpoints and two switches dedicated to cooling setpoints. Eachsetpoint can be used to set a target temperature for the cooling systemto reach, or alternatively two setpoints can be selected to act as anupper and lower desired temperature. The two heating setpoints mayrepresent two selectable target temperatures for the thermal managementsystem to heat to, while the two cooling setpoints may represent twoselectable target temperatures to cool to. A fifth switch of the dipswitch 78 can be used to select the speed of the fan inside theenclosure when the heating and cooling functions are not operating. Inone position, the fan runs full speed during an off time, and in theother position, the fan will slow to half speed during an off time. SeeFIG. 10.

The H-bridge 80 in the illustrated embodiment comprises four MOSFETtransistors, but may be formed with an integrated circuit or othersuitable discrete components. See FIG. 11 for exemplary circuit diagramsof the H-bridge 80 and suitable charge pumps therefor. In someembodiments, the positive H-bridge output may be used to provide heatingto the TEC, while the negative H-bridge output may be used to providecooling to the TEC; typically, either the positive or negative H-bridgeis operating, while the other is idle. The H-bridge 80 can provide anadjustable pulse width modulated (PWM) signal, between 10% and 100% ofthe full available electrical power, as an output of one or more of thetransistors. For example, the PWM signal can be sent through thepositive H-bridge output and through the negative H-bridge output. ThePWM signal can be applied to the TEC and components thereof. Forexample, by increasing the PWM signal the rotational speed of a fan maybe increased to move more air through the TEC. FIG. 12 illustrates anexemplary circuit for transistors 96, 98 of the H-bridge 80 to pass aPWM signal PWMI to a contact (e.g., a pin) of each header 90, 92. Ajumper block 94 can be used to match the voltage of the PWM signal tothat required by the device attached to each of the headers 90, 92. Themicrocontroller 74 can thus control the fan speed to, for example,reduce noise generated by the fans.

Referring again to FIGS. 7 and 8, the female input quick connector 60may be a rectangular female connector having five pin receiving holes.The pin receiving holes are preferably arranged in a line to minimizethe space taken on the circuit board 72 with respect to othercomponents, described below. The two outer pin holes can be keyed pinreceiving holes 62, such as with a square having one arched side, withthe two keyed pin receiving holes 62 having an arch on the same side,and the three inner pin holes may all be circular pin receiving holes64. The keyed holes 62 may require that a male input quick connectorattached to an input harness may be attached to the female input quickconnector 60 in only one orientation. The pin receiving holes 62 and 64may, for example, be configured to receive an input current from a powersupply. In an example configuration, the pin receiving holes 62, 64include a negative voltage inlet, a positive voltage inlet, a normalopen inlet, a common ground inlet, and a normal close inlet. In someembodiments, the female input quick connector 60 may be configured as afive-circuit Universal MATE-N-LOK connector produced by TycoElectronics.

The female input quick connector 60 may couple to an input harness(e.g., input harness 68 of FIG. 5) having a male input quick connector(not shown) with the same number of pin holes as the female input quickconnector 60 and similarly keyed. The male input quick connector mayattach in a detachable manner to a pair of protrusions 66 extending fromopposite sides of the female input quick connector 60, and adjacent tothe keyed pin receiving holes 62, to quickly and securely attach theinput harness to the controller 70. The input harness may connect thecontroller 70 to a power source (not shown) that delivers either 24 VDCor 48 VDC electric current to the controller 70 through the inputharness. The controller 70 can include switching regulators for steppingdown the voltage (e.g., from 48 VDC to 12 VDC, from 24 VDC to 12 VDC,and/or from 12 VDC to 5 VDC) as needed for various components disposedon or powered by the controller 70. See FIG. 13.

The female output quick connector 82 may be, for example, a rectangularfemale connector having two keyed pin receiving holes 84 in a line. Insome embodiments, the female output quick connector 82 may be configuredas a two-circuit Universal MATE-N-LOK connector produced by TycoElectronics. The pin receiving holes 84 may, for example, beelectrically connected to a first output from the H-bridge 80, which maybe a positive H-bridge output for controlling the heating function ofthe TEC, and to a second output from the H-bridge 80, which may be anegative H-bridge output for controlling the cooling function of the TEC(or, the positive and negative control functions may be reversed). Thefemale output quick connector 82 can deliver the received output(s) fromthe H-bridge 80 to an attached, compatible two-circuit output harness(not shown) which connects to the TEC. A male output quick connector ofthe output harness may attach in a detachable manner to a pair ofprotrusions 86 extending from opposite sides of the female output quickconnector 82, and adjacent to the keyed pin receiving holes 84, toquickly and securely attach the output harness to the controller 70.

Similarly, each of the device headers 90, 92 may receive one or moresignals from components of the controller 70, such as the H-bridge 80and/or the microcontroller 74, to control an external device, such as afan or other component of the TEC. The headers 90, 92 may bequick-connection headers, such as male 4-pin headers, or other outputquick connectors as described above. In one embodiment, the headers 90,92 each have a pin that receives a positive output voltage to bedelivered to the attached device, a pin connected to ground or receivinga “negative” (relative to the output voltage on the other pin) voltage,a pin that receives a PWM signal, as described above with respect toFIG. 12, and outputs it to the attached device, and a pin that receivesa signal back from the attached device. In an exemplary embodiment,described further below, the controller 70 controls a TEC having twofans, and power (i.e., the output voltage) and potentially otheroperating signals (e.g., the PWM signal) are supplied to each fan viaconnection of a fan harness between the fan and one of the headers 90,92. In the exemplary embodiment, the headers 90, 92 receive a fan speed(i.e. a tachometer or TACH) signal back from the corresponding attachedfan. See FIG. 14 for an exemplary circuit diagram of a fan speeddetection circuit that takes the fan speed signal delivered to eachheader 90, 92 from each fan as input, and delivers the fan speed signalto the microcontroller 74 for analysis. The microcontroller 74 candetermine whether or not either of the connected fans is operating, andat what speed, in order to generate and send a new PWM signal forcontrolling the fan speed when the fan speed should be changed (based onother signals processed by the microcontroller 74).

A thermistor (e.g., thermistor 102 of FIG. 5) may connect to thethermistor connector 100 and can supply a temperature signal to themicrocontroller 74, as shown in the temp sensor input circuit of FIG. 9.The microcontroller 74 can use the temperature signal to, for example,automatically adjust the PWM signal that controls the fans, as shown inthe fan PWM/control circuit of FIG. 12. Furthermore, the controller 70can determine from the temperature signal whether to generate an alertto an operator that the temperature is above or below a presettemperature range, or that the temperature signal is malfunctioning. Thecontroller 70 can similarly monitor other parameters of the TEC or thecontroller, including without limitation: the fan speed, as describedabove; the input voltage to the controller 70, with an input voltagemeasurement circuit such as that shown in FIG. 15; and, the currentconsumed (i.e., input current) by the TEC and/or the fans, with an inputcurrent monitoring circuit such as that shown in FIG. 16. Themicrocontroller 74 can generate one or more audible or visual alarms ifany of the monitored signals is outside of a preset range, using a relayoutput circuit such as that of FIG. 17. In some embodiments, thecontroller 70 can be configured so that the microcontroller 74 uses asingle relay and single alarm output to communicate the alarm,regardless of the parameter that causes the alarm.

The controller 70 can be configured to automatically detect theoperating voltage capability. The controller 70 can include one or morecommunication modules that enable remote access and control. Thecommunication module can communicate with a user device using anysuitable protocol, such as SNMP or modbus TCP protocol. The controllercan additionally or alternatively include one or more communicationmodules that enable the controller 70 to communicate with other TECcontrollers in a network. Any suitable communication module can be used,such as an RS-485 converter.

FIGS. 18A-24 illustrate an implementation of an unshroudedthermoelectric cooler 180 for a sealed enclosure. The cooler 180 usesthe Peltier effect to remove heat from around critical ortemperature-sensitive electronic equipment contained in the enclosure,and is also configured to contain and protect the controller 70 of thepresent disclosure. Components of the cooler 180 include, withoutlimitation: a frame 182 that mounts the cooler 180 to the enclosure; anexternal heat sink 184 for dissipating heat, the external heat sink 184mounted to the frame 182 so that the external heat sink 184 is outsideof the enclosure when the cooler 180 is installed; optionally, a sleeve186 for the external heat sink 184, the sleeve 186 mounting to the frame182 or to the external heat sink 184 and providing a planar surface formounting additional components; an external fan 188 mounted to the frame182 or to the sleeve 186 and drawing air into the cooler 180; aninternal heat sink 190 for dissipating heat, the internal heat sink 190mounted to the frame 182 so that the internal heat sink 190 is insidethe enclosure when the cooler 180 is installed; optionally, a sleeve 192for the internal heat sink 190, the sleeve 192 mounting to the frame 182or to the internal heat sink 190 and providing a planar surface formounting additional components; and, an internal fan 194 mounted to theframe 182 or to the sleeve 192 and circulating air within the enclosure.

A housing 200 for the present controller can be attached to the frame182, the internal heat sink 190, the sleeve 192, or another suitablecomponent of the cooler 180 (e.g., one of the external components). Thehousing 200 can include a front wall 202, a left wall 204, a rear wall206, and a right wall 208 that are attached to or integral with eachother, defining an interior space of the housing 200. In someimplementations, the interior space can be just large enough to containthe controller 70. In other implementations, including the exampleimplementation of FIGS. 18A-B, an interior space 201 defined by thehousing 200 can be larger (i.e., longer, with respect to vertical) thanthe controller 70, allowing the housing to contain other components. Forexample, the housing 200 can contain all or part of the internal fan 194as well as the controller 70. In some embodiments, the internal fan 194can be contained within a compartment of the housing 200 separated fromanother compartment containing the controller 70 by a cover 210 asdescribed below.

A cover 210 can span all or a portion of the interior space defined bythe walls 202-208. Referring to FIG. 18B, in some implementations thecover 210 can include a first member 212 that extends across theinterior space (e.g., parallel to the frame 182 or orthogonal to thewalls 202-208) and can be attached to or integral with a second member214 extending from the first member 212 (e.g. parallel to the walls202-208) into and dividing the interior space. As illustrated, the cover210 creates a second interior space that is divided from the interiorspace containing the internal fan 194. The cover 210 can include one ormore functional apertures. In one example, a first aperture 216 can bedisposed through the cover 210, facilitating connection of a thermistorto the controller 70 as described above. In another example, a secondaperture 218 can be disposed through the cover 210 near the internal fan194, providing airflow through the second interior space.

Referring to FIG. 21, the cover 210 can further include an attachmentmember 220 attached to or integral with the first member 212 and beingconfigured to attach the cover 210 to one of the walls 202-208, such asthe rear wall 206. Any suitable attachment mechanism(s) can be used toattach the cover 210 to the wall(s), including without limitation welds,fasteners such as rivets or screws, hinges, or, as illustrated, tabs 222disposed through slots in the wall (e.g., rear wall 206).

FIG. 24 illustrates an embodiment of mounting the controller 70 in thehousing 200. The controller 70 can be attached on one side with a firstbracket 224 to, for example, the sleeve 192. The controller 70 can bemounted at an acute angle α to the sleeve 192 (which establishes avertical plane of reference when the TEC is installed in an enclosure)in a manner that disposes the controller 70 under the cover 210. Thecontroller 70 can be attached on its other side with a second bracket226 to the rear wall 206. The brackets 224, 226 can be any suitablebracket for attaching the substrate (e.g., PCB) of the controller 70 tothe surfaces of the cooler 180, which are typically metal. Inparticular, the cooler 180 can be a fire proof or fire resistant coolerfor a fire proof enclosure, and the walls, sleeves, and other surfacesof the cooler 180 can be made out of a fire proof material, such asmetal, to prevent a fire from spreading into the enclosure from outsideof the enclosure, or to prevent a fire escaping out of the enclosurefrom within the enclosure.

FIG. 25 illustrates another embodiment of a thermal management system300 including a thermoelectric cooling unit 180 and a housing 200 asdescribed above with respect to FIGS. 18A-24. The walls 202-208 of thehousing 200 define an interior space 201 containing the internal fan 194and the small-footprint controller 30 described above with respect toFIGS. 4 and 5. The controller 30 can be mounted, using any of theattachment methods described above or another suitable attachmentmethod, to one or more of the walls 202-208 at an angle α′ to the sidewall 208 (which establishes a vertical plane of reference when the TECis installed in an enclosure) in a manner that disposes the controller30 under the cover. The cover then attaches to the walls and formsseparated compartments for the controller 30 and the internal fan 194 asshown in FIG. 18B.

It will be appreciated by those skilled in the art that while theinvention has been described above in connection with particularembodiments and examples, the invention is not necessarily so limited,and that numerous other embodiments, examples, uses, modifications anddepartures from the embodiments, examples and uses are intended to beencompassed by the claims attached hereto. The entire disclosure of eachpatent and publication cited herein is incorporated by reference, as ifeach such patent or publication were individually incorporated byreference herein. Various features and advantages of the invention areset forth in the following claims.

What is claimed is:
 1. A thermal management system for an enclosurecontaining electrical components, the thermal management systemcomprising: a cooling unit comprising: a frame that mounts the coolingunit to the enclosure such that the cooling unit cools a first interiorspace of the enclosure; a housing mounted on the frame and extendinginto the interior space of the enclosure when the cooling unit ismounted on the enclosure; and one or more fans supported at leastpartially by the frame and cooperating to circulate air that cools theinterior space; and a controller in electrical communication with thecooling unit and configured to operate one or more components of thecooling unit, the controller comprising: a circuit board mounted at anacute angle, with respect to vertical when the cooling unit is mountedon the enclosure, within the housing, the acute angle selected to allowthe controller to be disposed entirely within the housing; an inputquick connector disposed on the circuit board and configured to receivea first cable connector for providing power to the circuit board; and atleast a first output quick connector disposed on the circuit board inelectrical communication with the input quick connector, and configuredto receive a second cable connector for supplying one or more signalsfrom at least the input quick connector to the one or more components ofthe cooling unit.
 2. The thermal management system of claim 1, whereinthe housing comprises: a plurality of walls; and a cover attachable toone or more of the plurality of walls and, when attached, cooperatingwith the plurality of walls to enclose a portion of the housing, thecontroller being disposed within the portion of the housing enclosed bythe cover.
 3. The thermal management system of claim 2, wherein a firstfan of the one or more fans is disposed within the housing outside ofthe portion of the housing enclosed by the cover.
 4. The thermalmanagement system of claim 3, wherein the one or more fans include thefirst fan and a second fan mounted on an external side of the frame andpulling air into the cooling unit.
 5. The thermal management system ofclaim 1, wherein the cooling unit further comprises an internal heatsink attached to the frame on an internal side of the frame that facesinto the interior space when the cooling unit is installed on theenclosure, the internal heat sink being disposed between the frame andthe housing.
 6. A thermal management system for an enclosure containingelectrical components, the thermal management system comprising: athermoelectric cooling unit mounted on the enclosure such that thecooling unit cools an interior space of the enclosure, the cooling unitcomprising a frame and a first fan mounted on the frame for circulatingair within the interior space; a housing mounted on the cooling unit,the housing being disposed within the enclosure when the cooling unit ismounted on the enclosure; and a controller in electrical communicationwith the cooling unit and configured to operate one or more componentsof the cooling unit, the controller being located within the housing. 7.The thermal management system of claim 6, wherein the housing comprises:a wall dividing the housing into a first compartment and a secondcompartment, the first compartment containing all or a part of the firstfan, and the second compartment containing the controller; and a coverenclosing the second compartment, the controller mounted at an anglethat allows the controller to fit within the second compartment andunder the cover.
 8. The thermal management system of claim 6, whereinthe controller is mounted within the housing at an acute angle withrespect to vertical.
 9. The thermal management system of claim 6,wherein the controller comprises a circuit board and an input quickconnector disposed on the circuit board and configured to receive afirst cable connector for providing power to the circuit board.
 10. Thethermal management system of claim 9, wherein the controller furthercomprises a first output quick connector disposed on the circuit boardand electrically connected to the cooling unit to control the first fan.11. The thermal management system of claim 10, wherein the first outputquick connector comprises a first device header electrically connectedto the input quick connector and supplies from the controller to thefirst fan a positive first fan voltage, a negative first fan voltage,and a first pulse-width modulated speed signal, and receives from thefirst fan a first fan speed signal.
 12. The thermal management system ofclaim 11, wherein: the cooling unit further comprises a second fanmounted on the frame for pulling air into the enclosure; and thecontroller further comprises a second device header mounted on thecircuit board and electrically connected to the cooling unit to controlthe second fan, the second device header supplying from the controller apositive second fan voltage, a negative second fan voltage, and a secondpulse-width modulated speed signal, and receiving from the second fan asecond fan speed signal.
 13. The thermal management system of claim 10,wherein the first output quick connector supplies, from the controller,a negative H-bridge signal and a positive H-bridge signal, the negativeH-bridge signal controlling a cooling operation of the cooling unit, andthe positive H-bridge signal controlling a heating operation of thecooling unit.
 14. The thermal management system of claim 13, wherein thefirst output quick connector is a four-pin connector electricallyconnected to the input quick connector and further supplies, from thecontroller, a positive fan voltage and a negative fan voltage.
 15. Thethermal management system of claim 6, wherein the housing comprises: aplurality of walls; and a cover attachable to one or more of theplurality of walls and, when attached, cooperating with the plurality ofwalls to enclose a portion of the housing, the controller being disposedwithin the portion of the housing enclosed by the cover.
 16. The thermalmanagement system of claim 15, where the cover comprises a first memberforming within the housing a first compartment and a second compartment,and a second member integral with the first member and attached to afirst wall of the plurality of walls, the second member cooperating withthe first member and one or more of the plurality of walls to enclosethe second compartment, the controller being mounted within the secondcompartment.
 17. The thermal management system of claim 15, wherein thecover comprises an aperture for connecting a thermistor to thecontroller from external the housing.
 18. The thermal management systemof claim 6, wherein the cooling unit further comprises a heat sinkattached to the frame and a sleeve attached to the frame and disposedover the heat sink, the housing being mounted on the frame viaattachment of the housing to the sleeve.